Flexible Electronics Market by Components (Display, Battery, Sensor, Photovoltaic, Memory), Circuit Structure (Single-Sided, Double-Sided, Rigid) Application (Consumer Electronics, Healthcare, Automotive, Energy and Power) & Geography - Analysis & Forecas - myFOXnepa.com

Flexible Electronics Market by Components (Display, Battery, Sensor, Photovoltaic, Memory), Circuit Structure (Single-Sided, Double-Sided, Rigid) Application (Consumer Electronics, Healthcare, Automotive, Energy and Power) & Geography - Analysis & Forecas

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SOURCE RnRMarketResearch.com

DALLAS, July 30, 2014 /PRNewswire/ --


Global flexible electronics market is expected to reach $13.23 Billion by 2020 at an estimated CAGR of 21.73% with the number of applications using printing processes for flexible electronics forecast to grow at a good rate. Major market drivers for flexible electronics include the possibility to add new functionalities like conformability for OLED lighting (for the automotive industry), for OPV (energy harvesting), Robustness for small OLED displays (for smart phones & tablets) as well as feasibility to create new applications like wearable electronics.

Flexible electronics is a field in which the integrated circuits are built on substrate like plastic or metallic foil, which can be folded, wrapped, twisted, or rolled without affecting its electronic function. The flexible electronic market is growing with highly increasing demand rate due to its flexible handling capability and reduced assembly costs. The flexible electronic devices have started penetrating in different applications in the sectors such as consumer electronics, medical and healthcare, and power and energy, automotive and defense. This research study, "Flexible Electronics Market by Components (Display, Battery, Sensor, Photovoltaic, Memory), Circuit Structure (Single-Sided, Double-Sided, Rigid) Application (Consumer Electronics, Healthcare, Automotive, Energy and Power) & Geography - Analysis & Forecast to 2014 - 2020", available at http://www.rnrmarketresearch.com/flexible-electronics-market-by-components-display-battery-sensor-photovoltaic-memory-circuit-structure-single-sided-double-sided-rigid-application-consumer-electronics-healthcare-automot-market-report.html,   focuses on various component segments such as; flexible display, flexible battery, flexible sensor, flexible memory and thin film PV (CIGS); the market for printed memory component is expected to grow at a higher CAGR in the forecast period.

The emerging consumer electronics market is expected to grow at a CAGR of 44.30% in the forecast period. North America is the biggest flexible electronics market, followed by Europe and APAC. The development of ?exible electronics has spanned the past few years, ranging from the development of ?exible solar cell arrays to ?exible OLED electronics on plastic substrates. The rapid development of this ?eld has been spurred by consistent technological development in large-area electronics, thereby developing the areas like ?at-panel electronics, medical image sensors, and electronic paper. Many factors contribute to the rise of ?exible electronics they are more ruggedness, lightweight, portable, and less cost, with respect to production as compared to rigid substrate electronics. Basic electronic structure is composed of a substrate, backplane electronics, a front plane, and encapsulation. To make the structure ?exible, all the components must bend up to some degree without losing their function. Two basic approaches have been adopted to make ?exible electronics, that is, transfer and bonding of completed circuits to a ?exible substrate and fabrication of the circuits directly on the ?exible substrate.

Companies profiled in this flexible electronics market report include LG Electronics, Samsung Electronics Co. Ltd., 3M Co., First Solar, Multi-Fineline Electronix Inc., Pragmatic Printing Limited, Solar Frontier K.K., E Ink Holdings Inc., Cymbet Corporation Inc, Front Edge Technologies, Thinfilm Electronics ASA, Solicore Inc and GE Measurement & Control Solutions. Order a copy of this report at http://www.rnrmarketresearch.com/contacts/purchase?rname=195044 .

The report also draws the competitive landscape of the Flexible electronics industry by analyzing the major players and the strategies adopted by them for growth in the market. Apart from the market segmentation data, the report also includes qualitative analysis of various market dynamics such as the drivers, restraints, opportunities, burning issues, and winning imperatives. The report includes profiles of major market players in the global flexible electronics market with their respective market share analysis.

Microcontrollers, DSP, & IP Core Chip Market by Type, Applications (Automotive & Transportation, Consumer Electronics, Industrial, Communications, Security, and Medical & Healthcare) and Geography (Americas, Europe, APAC & ROW) - Analysis & Forecast to 2014 - 2020 is a July 2014 publication spread across 300 pages. Increased numbers of new devices and applications, such as wearable electronics, smartphone and tablets, imaging devices, and more, drive the demand of DSP. Applications such as mobile TV, online gaming, and Internet browsing increase the demand of DSP. These devices have created real time applications that have generated huge data, leading to demand of multi-core DSPs. DSPs provide low power consumption and high speed, which are required for new age devices. Companies profiled in this research include Altera Corporation (U.S.), Analog Devices Inc. (U.S.), ARM Holdings PLC (U.S.), Cadence Design Systems (U.S.), CEVA Inc. (U.S.), Freescale Semiconductor Inc. (U.S.), Infineon Technologies AG (Germany), Maxim Integrated Products Inc. (U.S.), Panasonic Corporation (Japan), Renesas Electronics Corporation (Japan), Stmicroelectronics N.V. (Switzerland), Texas Instruments Inc. (U.S.) and Xilinx Inc. (U.S.). Complete report is available at http://www.rnrmarketresearch.com/microcontrollers-dsp-ip-core-chip-market-by-type-applications-automotive-transportation-consumer-electronics-industrial-communications-security-and-medical-healthcare-and-geography-am-market-report.html.

Smart / Intelligent Sensor Market by Type (Flow Sensor, Dissolved Oxygen Sensor, Temperature Sensor, Pressure Sensor, Touch Sensor), Technology (MEMS, CMOS), Application (Aerospace, Automotive, Industrial, Building Automation), & by Geography - Forecasts & Analysis to 2013 - 2020 is a 394 pages March 2014 publication that says currently, the U.S., U.K., South Korea and China are the major countries who have captured the smart sensor market and according to the forecast, the next growing countries which will move their position upwards up to 2020 will be Canada and Germany. The China and Brazil will also show upward growth and boosting their profits. The technologies which are incorporated in smart sensors are Micro-Electro-Mechanical Systems (MEMS), Complementary Metal Oxide semiconductor (CMOS) technology, and Optical spectroscopy. Currently, pressure sensors are being employed in smart phones and computer devices having touch screen displays. So, it is expected that it will bring a widely used platform for smart sensors. Companies like ABB Ltd, Airmar Technology CORPoration, Analog Devices, inc, Banpil Photonics inc., Beanair, Colibrys Ltd., Comus international, Eaton Corporation, Freescale Semiconductor inc, Gira Giersiepen Gmbh & Co. Kg, Honeywell international inc, Infineon Technologies AG, Innovative Sensor Technology (Ist) AG, Nanjing IOT Sensor Technology Co. Ltd, Oceana Sensor Technologies inc., Siemens AG, Sensirion AG, Smart Sensors inc., Vishay intertechnology inc. and XYZ interactive Technologies inc. are profiled in this research available at http://www.rnrmarketresearch.com/smart-intelligent-sensor-market-by-type-flow-sensor-dissolved-oxygen-sensor-temperature-sensor-pressure-sensor-touch-sensor-technology-mems-cmos-application-aerospace-automotive-indust-market-report.html.

Explore more reports on electronics market and other IT & telecommunications sectors at http://www.rnrmarketresearch.com/reports/information-technology-telecommunication.

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